 Wafer For MEMS .jpg)
schott hermes
$282.00
In stock
Description
schott hermes,SCHOTT Electronic Packaging offers the HermeS® glass substrate wafer with hermetically sealed solid “Through Glass Vias” (TGV) designed to enable fully gastight and long-term .
Beige and white GG Supreme canvas
HermeS Hermetic Through Glass Via (TGV) Wafer For MEMS
Gold-toned hardware
Hermetic Sensor Packaging
Double G
Inside: 1 open pocket
SCHOTT HermeS® Glass Wafers with Hermetic Through
Chain top handle with 7″ drop
Top zip closure
HermeS Hermetic Through Glass Via (TGV) Wafer For MEMS
5.2″W x 5.3″H x 3.8″D
Weight: 0.7lbs approximately
SCHOTT HermeS® Glass Wafers with Through Glass Vias for
Additional information
| Dimensions | 5.3 × 2.7 × 1.6 in |
|---|
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