schott hermes
$231.00
In stock
Description
schott hermes,HermeS® glass wafer substrates with hermetically sealed, solid through-glass vias (TGV) enable ultra-miniaturized, fully hermetic sensors and MEMS devices in Wafer Level Chip Size .
Beige and white GG Supreme canvas
SCHOTT Advances MEMS Technology by Using HermeS®
Gold-toned hardware
Hermetic Sensor Packaging
Double G
Inside: 4 open pocket
SCHOTT HermeS® Glass Wafers with Hermetic Through
Chain top handle with 7″ drop
Top zip closure
HermeS Hermetic Through Glass Via (TGV) Wafer For MEMS
6.7″W x 3.4″H x 3.9″D
Weight: 0.9lbs approximately
SCHOTT HermeS® Glass Wafers with Through Glass Vias for
Additional information
| Dimensions | 6.7 × 1.5 × 3.3 in |
|---|
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